The agreement combines Samsung’s semiconductor manufacturing with IBM’s high-performance CPU designs. This combination aims to drive unmatched system performance. This includes acceleration, memory and I/O bandwidth, encryption and compression speed, as well as system scaling.
It positions IBM and Samsung as strategic partners in the new era of high-performance computing specifically designed for AI.
“At IBM, our first priority is our clients,” said John Acocella, IBM Systems. “IBM selected Samsung to build our next generation of microprocessors because they share our level of commitment to the performance, reliability, security, and innovation that will position our clients for continued success on the next generation of IBM hardware.”
The announcement also expands and extends the 15-year strategic process technology partnership between the two companies. As part of IBM’s Research Alliance, this includes many industry firsts such as the first NanoSheet Device innovation for sub 5nm, the production of the industry’s first 7nm test chip and the first High-K Metal Gate foundry manufacturing. IBM’s Research Alliance ecosystem continues to define the leadership roadmap for the semiconductor industry.
“We are excited to expand our decade-long strategic relationship with IBM with our 7nm EUV process technology,” said Ryan Lee, Samsung Electronics. “This collaboration is an important milestone for Samsung’s foundry business. That’s because it signifies confidence in Samsung’s cutting-edge high performance EUV process technology.”
Samsung is a member of the OpenPower Foundation. This is a vendor ecosystem facilitating the development of IBM Power servers, networking and storage for future data centers. Samsung is also a member of the Q Network. It aims to help advance the understanding of applications software in quantum computing for the industry.